Pressure sensor, pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit board

A manufacturing method for a pressure-sensitive circuit board, comprising:

• providing a circuit substrate, the circuit substrate being provided with a dielectric layer and a conductive wiring layer formed on the dielectric layer;
• forming a plurality of conductive convex blocks on the conductive wiring layer, a receiving space being defined between adjacent two of the plurality of conductive convex blocks;
• and
• forming a strain member on the plurality of conductive convex blocks, causing the strain member to cover each of the receiving space, thereby obtaining the pressure-sensitive circuit board.

A pressure sensor comprising:

• a pressure-sensitive circuit board comprising:
• a circuit substrate;
• a plurality of conductive convex blocks;
• and
• a strain member,
• wherein the circuit substrate comprises a dielectric layer and a conductive wiring layer formed on the dielectric layer, the plurality of conductive convex blocks is formed on the conductive wiring layer and spaced from each other, and a receiving space is defined between adjacent two of the plurality of conductive convex blocks, and
• the strain member is formed on the plurality of conductive convex blocks and covers each of the receiving space, the strain member is deformable by an external force, and each of the receiving space is configured to receive at least a portion of the strain member when the stain member is deformed.