Cooling module for baking device and substrate treating apparatus including the same

A cooling module for a substrate baking apparatus comprising:

• a cooling unit for cooling a hot plate for heating a substrate,
• wherein the cooling unit comprises,
• a support plate having a space formed between the support plate and the hot plate, and
• a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate,
• wherein an outdoor air inlet passage provided in a through structure in the support plate and located outside the plurality of nozzles is provided,
• wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.

A cooling module for a substrate baking apparatus comprising:

• a cooling unit for cooling a hot plate for heating a substrate,
• wherein the cooling unit comprises,
• a support plate having a space formed between the support plate and the hot plate and a discharge hole formed in a center, and
• a plurality of nozzles installed in the support plate and for supplying a cooling gas to a bottom surface of the hot plate, and disposed adjacent to a periphery with respect to a center of the support plate, wherein the cooling gas is discharged in an oblique direction toward a center of the hot plate with respect to a periphery of the hot plate,
• wherein an outdoor air inlet passage provided in a through structure in the support plate, and located outside the plurality of nozzles is provided,
• wherein a portion of the outdoor air inlet passage forms a first region, through which the cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.