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US 2023/0407466 A1Published application
Deposition method and deposition apparatus
AssigneeTokyo Electron Limited
InventorsMuneyuki OTANI, Akira MATSUBARA
Life of this patent
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Abstract
A deposition method includes: (a) preparing a substrate with a recess on a surface thereof; (b) supplying an organic raw material gas to the surface to adsorb the organic raw material gas to the recess; (c) supplying an oxygen-containing gas to the surface to oxidize the organic raw material gas adsorbed to the recess; and (d) after the (c), supplying a first gas containing a dehydrating agent to the surface.
Claims8
A deposition method comprising:
- (a) preparing a substrate with a recess on a surface thereof;
- (b) supplying an organic raw material gas to the surface to adsorb the organic raw material gas to the recess;
- (c) supplying an oxygen-containing gas to the surface to oxidize the organic raw material gas adsorbed to the recess;
- and
- (d) after the (c), supplying a first gas containing a dehydrating agent to the surface.
2 more elements
A deposition apparatus comprising:
- a vacuum chamber;
- a gas supplier configured to supply a gas into the vacuum chamber;
- and
- a controller,
- wherein the controller is configured to control the gas supplier to perform:
- (a) preparing a substrate with a recess on a surface thereof;
- (b) supplying an organic raw material gas to the surface to adsorb the organic raw material gas to the recess;
- (c) supplying an oxygen-containing gas to the surface to oxidize the organic raw material gas adsorbed to the recess;
- and
- (d) after the (c), supplying a first gas containing a dehydrating agent to the surface.
7 more elements
Dependencies are inferred from the claim text.