Back to results
US 2023/0407465 A1Published application
METHOD OF FORMING SiOCN LAYER
AssigneeASM IP Holding B.V.
InventorTakashi Yoshida
Life of this patent
Estimating the term…
Abstract
A method of forming a silicon oxycarbonitride layer on a substrate is disclosed. An exemplary method includes forming a layer comprising SiOC and forming a layer comprising SiCN, which together form the silicon oxycarbonitride layer.
Claims21
A method of forming a silicon oxycarbonitride layer, the method comprising:
- providing a substrate within a reaction chamber of a reactor;
- forming a layer comprising SiOC, the step of forming the layer comprising SiOC comprising:
- providing a first silicon precursor within the reaction chamber to thereby form first silicon species on the surface of the substrate;
- providing a first reactant to the reaction chamber;
- and
- forming activated species from the first reactant;
- forming a layer comprising SiCN, the step of forming the layer comprising SiCN comprising:
- providing a second silicon precursor within the reaction chamber to thereby form second silicon species on the surface of the substrate;
- providing a second reactant to the reaction chamber;
- and
- forming activated species from the second reactant,
- wherein the first silicon precursor and the second silicon precursor differ, and
- wherein the first reactant and the second reactant do not comprise nitrogen.
10 more elements
Dependencies are inferred from the claim text.