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US 2023/0407149 A1Published application
Adhesive tape and processing method
AssigneeDenka Company Limited
InventorsChie NAKAMURA, Tomoaki TANAKA, Sota TOKUI, Mizuki HASUMI
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Abstract
Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, a tensile modulus of elasticity of the adhesive layer after ultraviolet irradiation is 400 MPa or less, and an elongation at break of the adhesive layer after ultraviolet irradiation is 16% or more.
Claims13
An adhesive tape comprising
- a base material layer and an adhesive layer disposed on the base material layer, wherein
- the adhesive layer comprises a radical photoinitiator and a polymer A having a polymerizable carbon double bond,
- a tensile modulus of elasticity of the adhesive layer after ultraviolet irradiation is 400 MPa or less, and
- an elongation at break of the adhesive layer after ultraviolet irradiation is 16% or more.
1 more element
Dependencies are inferred from the claim text.