Dual laser optic module of turntable type probe pin bonding apparatus

A dual laser optic module of a turntable-type probe pin laser bonding apparatus comprising:

• a pickup unit that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper consisting of a pair of clamps;
• a dipping unit applies solder paste to the probe pin transferred by the pickup unit;
• and
• a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam respectively onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit, wherein
• a body unit of a circular or polygonal shape with an empty interior;
• a first laser connection unit connected in a first direction toward the inside of the body part to which a first laser beam of a specific wavelength band is incident;
• a second laser connection unit connected in a second direction orthogonal to the first direction toward the inside of the body part to receive a second laser beam of a specific wavelength band;
• a laser filter unit equipped inside the body part and overlapping the first laser beam and the second laser beam that meet inside the body part to have a co-focus by being transmitted or reflected, respectively;
• and
• an overlapping laser emitting unit emitting the overlapped laser beam in a third direction of the body part to have a co-focus by the laser filter part.