Systems for improved efficiency of ball mount cleaning and methods for using the same

A system configured to clean a semiconductor package assembly, comprising:

• a sprayer device comprising a plurality of fluidic nozzles configured to direct a pressurized cleaning fluid at the semiconductor package assembly;
• a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction;
• and
• a dryer spatially displaced from the sprayer device along the first direction and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device,
• wherein the dryer is configured as a jet air knife configured to generate the pressurized gas flow having a pressure in a third range from approximately 0.02 MPa to approximately 0.08 MPa at a distance from the semiconductor package assembly that is in a range from approximately 0 mm to approximately 20 mm.

A sprayer device for a semiconductor package assembly cleaning system, comprising:

• a plurality of fluidic nozzles configured to direct a pressurized cleaning fluid toward a semiconductor package assembly as the semiconductor package assembly is moved along a first direction relative to the sprayer device,
• wherein each of the plurality of fluidic nozzles are displaced from one another along a second direction,
• wherein the plurality of fluidic nozzles comprises a first plurality of fluidic nozzles and a second plurality of fluidic nozzles that are located between adjacent ones of the first plurality of fluidic nozzles, and
• wherein the second plurality of fluidic nozzles are further displaced from the first plurality of fluidic nozzles along a direction perpendicular to the second direction.