Thermoelectric Cooling Modules
AssigneeApple Inc.
InventorMiikka M. Kangas
Life of this patent
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Abstract
Various embodiments disclosed herein describe thermoelectric cooling modules. The thermoelectric cooling modules may include a first substrate positioned over a second substrate in a vertical stacking direction, and may include a thermoelectric connector that thermally connects the first and second substrates. The thermoelectric connector may be configured to transfer heat laterally relative to the vertical stacking direction to provide more efficient heat transfer between the first substrate and the second substrate.
Claims20
An thermoelectric cooling module comprising:
- a first substrate;
- a second substrate, wherein the first substrate is positioned above the second substrate in a vertical stacking direction;
- a set of thermally-insulating support posts mechanically supporting the first substrate above the second substrate;
- and
- a thermoelectric connector connected to the first substrate and the second substrate and comprising a first terminal, a second terminal, and a plurality of semiconductor elements electrically coupled in series, wherein:
- the thermoelectric connector thermally couples the first substrate to the second substrate;
- and
- the thermoelectric connector is configured such that when a current is driven through the thermoelectric connector between the first terminal and the second terminal, heat flows laterally through at least a portion of each semiconductor element of the plurality of semiconductor elements in a corresponding lateral direction orthogonal to the vertical stacking direction.
A thermoelectric cooling module comprising:
- a first substrate;
- a second substrate, wherein the first substrate is suspended above the second substrate in a vertical stacking direction;
- and
- a thermoelectric connector that thermally couples the first substrate to the second substrate and comprises a plurality of semiconductor elements electrically coupled in series, wherein:
- each semiconductor element of the plurality of semiconductor elements comprises a corresponding suspended portion that is thermally separated from the first substrate by a first distance along the vertical stacking direction and is thermally separated from the second substrate by a second distance along the vertical stacking direction.
A thermoelectric cooling module comprising:
- a first substrate;
- a second substrate, wherein the first substrate is suspended above the second substrate in a vertical stacking direction;
- and
- a thermoelectric connector that thermally couples the first substrate to the second substrate and comprising:
- a first semiconductor element having a first conductivity type;
- a second semiconductor element having a second conductivity type opposite the first conductivity type;
- an upper connector that electrically connects the first semiconductor element to the second semiconductor element, and that thermally connects the first semiconductor element and the second semiconductor element to the first substrate;
- a first lower connecter spaced laterally from the upper connector in a first lateral direction orthogonal to the vertical stacking direction, wherein the first lower connector thermally connects the first semiconductor element to the second substrate;
- and
- a second lower connector spaced laterally from the upper connector in a second lateral direction orthogonal to the vertical stacking direction, wherein the first lower connector thermally connects the second semiconductor element to the second substrate.
Dependencies are inferred from the claim text.