Solid-state imaging device and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorsTomoki HIRAMATSU, Hideaki TOGASHI, Nobuhiro KAWAI
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Abstract
The quantum efficiency can be improved. A solid-state imaging device according to an embodiment includes: a plurality of pixels arranged in a matrix, in which each of the pixels includes a first semiconductor layer, a photoelectric conversion section disposed on the first semiconductor layer on a side of a first surface, an accumulation electrode disposed on the first semiconductor layer close to a side of a second surface on a side opposite to the first surface, a wiring extending from the second surface of the first semiconductor layer, a floating diffusion region connected to the first semiconductor layer via the wiring, and a first gate electrode disposed close to the wiring.
Claims20
A solid-state imaging device, including:
- a plurality of pixels arranged in a matrix, wherein
- each of the pixels includes
- a first semiconductor layer,
- a photoelectric conversion section disposed on the first semiconductor layer on a side of a first surface,
- an accumulation electrode disposed on the first semiconductor layer close to a side of a second surface on a side opposite to the first surface,
- a wiring extending from the second surface of the first semiconductor layer,
- a floating diffusion region connected to the first semiconductor layer via the wiring, and
- a first gate electrode disposed close to the wiring.
Dependencies are inferred from the claim text.