Microwave providing apparatus, system including the same, and method of manufacturing semiconductor device
AssigneeSemes Co., Ltd.
InventorsYoonseok Choi, Hanlim Kang, Hyunwoo Jo, Sangjeong Lee
Life of this patent
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Abstract
Provided is a system including a microwave source configured to generate microwaves, a branch apparatus including an input port connected to the microwave source, first and second chambers configured to process a wafer by using the microwaves, a first filter configured to transfer the microwaves to or cut off the microwaves from the first chamber, and connected to a first output port of the branch apparatus, and a second filter configured to transfer the microwaves to or cut off the microwaves from the second chamber, and connected to a second output port of the branch apparatus.
Claims20
A system comprising:
- a microwave source configured to generate microwaves;
- a branch apparatus including an input port connected to the microwave source;
- first and second chambers configured to process a wafer by using the microwaves;
- a first filter configured to transfer the microwaves to or cut off the microwaves from the first chamber, and connected to a first output port of the branch apparatus;
- and
- a second filter configured to transfer the microwaves to or cut off the microwaves from the second chamber, and connected to a second output port of the branch apparatus.
A microwave providing apparatus comprising:
- a microwave source configured to generate microwaves;
- a first branch apparatus connected to the microwave source, and configured to split the microwaves;
- second and third branch apparatuses connected to the first branch apparatus, and configured to split the microwaves transferred from the first branch apparatus;
- a first filter connected to a first output port of the second branch apparatus, and configured to transfer the microwaves to or cut off the microwaves from a first chamber configured to process a first wafer;
- a second filter connected to a second output port of the second branch apparatus, and configured to transfer the microwaves to or cut off the microwaves from a second chamber configured to process a second wafer;
- a third filter connected to a third output port of the third branch apparatus, and configured to transfer the microwaves to or cut off the microwaves from a third chamber configured to process a third wafer;
- and
- a fourth filter connected to a fourth output port of the third branch apparatus, and configured to transfer the microwaves to or cut off the microwaves from a fourth chamber configured to process a fourth wafer.
A method of manufacturing a semiconductor device, the method comprising etching an etching target material within a first chamber by allowing a first filter connected to the first chamber to be in a state allowing microwaves to pass through the first filter, and performing, in each of second to fourth chambers, any one of a surface change of adsorbing a first reactant on the etching target material, a first purge of introducing an inert gas to remove residue of the first reactant, and a second purge of introducing an inert gas to remove by-products generated by the etching, by allowing each of second to fourth filters connected to the second to fourth chambers to be in a state of cutting-off from the microwaves, wherein the etching of the etching target material within the first chamber includes removing the etching target material and the first reactant adsorbed on the etching target material, by using the microwaves and a second reactant.
Dependencies are inferred from the claim text.