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US 2023/0402486 A1Published application
Imaging methods using radiation detectors
AssigneeShenzhen Xpectvision Technology Co., Ltd.
InventorsPeiyan CAO, Yurun LIU
Life of this patent
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Abstract
Disclosed herein is a method, comprising: capturing via an exposure a first image with a first radiation detector which comprises a first active area and a first dummy area, wherein the first dummy area is disposed between application-specific integrated circuit (ASIC) chips of the first radiation detector, and wherein the first image comprises (A) first regular picture elements corresponding to the first active area and (B) first dummy picture elements corresponding to the first dummy area; and determining values of the first dummy picture elements based on values of the first regular picture elements.
Claims19
A method, comprising:
- capturing via an exposure a first image with a first radiation detector which comprises a first active area and a first dummy area,
- wherein the first dummy area is disposed between application-specific integrated circuit (ASIC) chips of the first radiation detector, and
- wherein the first image comprises (A) first regular picture elements corresponding to the first active area and (B) first dummy picture elements corresponding to the first dummy area;
- and
- determining values of the first dummy picture elements based on values of the first regular picture elements;
- wherein the first dummy area comprises multiple dummy sensing elements;
- wherein each of the multiple dummy sensing elements comprises an electrical contact which is (A) other than a same common electrical contact shared by the multiple dummy sensing elements and (B) not electrically connected to the ASIC chips, or each of the multiple dummy sensing elements does not comprise an electrical contact other than a same common electrical contact shared by the multiple dummy sensing elements.
4 more elements
A method, comprising:
- for i=1, . . . , N, one by one, capturing via an exposure (i) a partial image (1, i) with a same first radiation detector which comprises a first active area and a first dummy area, N being an integer greater than 1;
- stitching the partial images (1, i), i=1, . . . , N resulting in a first combined image, wherein the first combined image comprises (A) first regular picture elements corresponding to the first active area and (B) first dummy picture elements corresponding to the first dummy area;
- and
- determining values of the first dummy picture elements based on values of the first regular picture elements;
- wherein the first dummy area is disposed between application-specific integrated circuit (ASIC) chips of the first radiation detector;
- wherein the first dummy area comprises multiple dummy sensing elements;
- wherein each of the multiple dummy sensing elements comprises an electrical contact which is (A) other than a same common electrical contact shared by the multiple dummy sensing elements and (B) not electrically connected to the ASIC chips, or each of the multiple dummy sensing elements does not comprise an electrical contact other than a same common electrical contact shared by the multiple dummy sensing elements.
4 more elements
A method, comprising:
- for i=1, . . . , N, one by one, capturing via an exposure (i) a partial image (1, i) with a same first radiation detector which comprises a first active area and a first dummy area, N being an integer greater than 1, wherein the partial image (1, i) comprises (A) regular picture elements (1, i) corresponding to the first active area and (B) dummy picture elements (1, i) corresponding to the first dummy area;
- for i=1, . . . , N, determining values of the dummy picture elements (1, i) based on values of the regular picture elements (1, i), and assigning the determined values of the dummy picture elements (1, i) to the dummy picture elements (1, i) resulting in a modified partial image (i);
- and
- stitching the modified partial images (i), i=1, . . . , N resulting in a first combined image;
- wherein the first dummy area is disposed between application-specific integrated circuit (ASIC) chips of the first radiation detector;
- wherein the first dummy area comprises multiple dummy sensing elements;
- wherein each of the multiple dummy sensing elements comprises an electrical contact which is (A) other than a same common electrical contact shared by the multiple dummy sensing elements and (B) not electrically connected to the ASIC chips, or each of the multiple dummy sensing elements does not comprise an electrical contact other than a same common electrical contact shared by the multiple dummy sensing elements.
4 more elements
Dependencies are inferred from the claim text.