Image sensor with high quantum efficiency
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Chien HSIEH, Hsin-Chi Chen, Kuo-Cheng Lee, Yun-Wei Cheng
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Chien HSIEH, Hsin-Chi Chen, Kuo-Cheng Lee, Yun-Wei Cheng
Estimating the term…
The present disclosure describes an image sensor device and a method for forming the same. The image sensor device can include a semiconductor layer. The semiconductor layer can include a first surface and a second surface. The image sensor device can further include an interconnect structure formed over the first surface of the semiconductor layer, first and second radiation sensing regions formed in the second surface of the semiconductor layer, a metal stack formed over the second radiation sensing region, and a passivation layer formed through the metal stack and over a top surface of the first radiation sensing region. The metal stack can be between the passivation layer and an other top surface of the second radiation sensing region.
An image sensor device, comprising:
A structure, comprising:
An image sensing device, comprising:
Dependencies are inferred from the claim text.