Semiconductor device and manufacturing method thereof

Abstract

A semiconductor device according to the present embodiment includes a substrate, a first semiconductor chip, a second semiconductor chip, a bonding layer, and a member. The substrate has a first surface. The first semiconductor chip is provided on the first surface. The second semiconductor chip is provided above the first semiconductor chip, has a second surface facing the first surface and the first semiconductor chip, and coats the first semiconductor chip as viewed from a direction substantially perpendicular to the first surface. The bonding layer is provided between the second surface and both the first surface and the first semiconductor chip. The member is provided on at least part of an outer periphery of the bonding layer as viewed from the direction substantially perpendicular to the first surface.

Dependencies are inferred from the claim text.