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US 2023/0402409 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChung-Yu Ke, Liang-Pin Chen
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which a plurality of antenna structures and a heat sink are integrated on a package module including an electronic element, so as to guide the heat energy generated by the electronic element out of the package module via the heat sink. Therefore, when the electronic package is configured with the plurality of antenna structures, the heat dissipation of the electronic element can be improved.
Claims21
An electronic package, comprising:
- a package module internally configured with at least one electronic element and a plurality of feeding lines electrically connected to the at least one electronic element, wherein the plurality of feeding lines are defined with a first antenna layer and a second antenna layer;
- a heat sink disposed on a portion of a surface of the package module and extending into the package module to thermally connect the at least one electronic element;
- first antenna bodies disposed on portions of the surface of the package module corresponding to a position of the first antenna layer, wherein the first antenna bodies and the first antenna layer are kept at a distance, such that the first antenna bodies and the first antenna layer form a first antenna structure;
- an insulating spacer disposed on a portion of the surface of the package module;
- and
- second antenna bodies disposed on the insulating spacer corresponding to a position of the second antenna layer, wherein the second antenna bodies and the second antenna layer are located on opposite sides of the insulating spacer, such that the second antenna bodies and the second antenna layer form a second antenna structure.
3 more elements
A method of manufacturing an electronic package, comprising:
- providing a package module internally configured with at least one electronic element and a plurality of feeding lines electrically connected to the at least one electronic element, wherein the plurality of feeding lines are defined with a first antenna layer and a second antenna layer;
- disposing an insulating spacer on a portion of a surface of the package module;
- forming a heat sink on a portion of the surface of the package module, wherein the heat sink extends into the package module to thermally connect the at least one electronic element;
- and
- forming first antenna bodies on portions of the surface of the package module corresponding to a position of the first antenna layer and forming second antenna bodies on the insulating spacer corresponding to a position of the second antenna layer, wherein the first antenna bodies and the first antenna layer are kept at a distance, such that the first antenna bodies and the first antenna layer form a first antenna structure, and wherein the second antenna bodies and the second antenna layer are located on opposite sides of the insulating spacer, such that the second antenna bodies and the second antenna layer form a second antenna structure.
2 more elements
Dependencies are inferred from the claim text.