Back to results
US 2023/0402402 A1Published application
Semiconductor Package and Method
OwnerShu-Shen Yeh, Chien Hung Chen +3inventors
InventorsShu-Shen Yeh, Chien Hung Chen, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a recessed stiffener ring and a method of forming are provided. The semiconductor package may include a substrate, a semiconductor die bonded to the substrate, an underfill between the semiconductor die and the substrate, and a stiffener ring attached to the substrate, wherein the stiffener ring encircles the semiconductor die in a top view. The stiffener ring may include a recess that faces the semiconductor die.
Claims20
A semiconductor package comprising:
- a substrate comprising a first edge and a second edge opposite the first edge;
- a package component bonded to the substrate, wherein the package component comprises a semiconductor die, wherein a first edge of the package component is a closest edge of the package component to the first edge of the substrate;
- an underfill between the package component and the substrate;
- and
- a ring structure attached to the substrate, wherein the ring structure encircles the package component in a top view, the ring structure comprising:
- a first segment extending along the first edge of the substrate, wherein the first segment has a first width, the first width being a distance between an outer edge of the first segment and an inner edge of the first segment, wherein the first segment comprises a recess extending at least partially through the ring structure, and wherein the recess faces the first edge of the package component in the top view.
3 more elements
A semiconductor package comprising:
- a substrate;
- a package component bonded to the substrate, wherein the package component comprises a semiconductor die;
- an underfill between the package component and the substrate;
- and
- a frame structure attached to the substrate, wherein the frame structure encloses the package component in a top view, the frame structure comprising:
- a first bar along a first edge of the substrate, wherein the first bar comprises a first portion having a first width, a second portion having a second width, and a third portion having the first width, wherein the first width is greater than the second width, wherein the second portion is disposed between the first portion and the third portion, and wherein a closest edge of the second portion to the first edge of the substrate is level with a closest edge of the first portion to the first edge of the substrate and a closest edge of the third portion to the first edge of the substrate.
3 more elements
A method of manufacturing a semiconductor package, the method comprising:
- bonding one or more package components to a substrate, wherein the one or more package components comprise one or more semiconductor dies, wherein a first package component of the one or more package components is disposed at a center of the substrate, wherein the substrate comprises a first edge and a second edge opposite the first edge, and wherein a first edge of the first package component is a closest edge of the first package component to the first edge of the substrate;
- placing an underfill between the one or more package components and the substrate;
- and
- attaching a ring structure to the substrate, wherein the ring structure encircles the one or more package components in a top view, the ring structure comprising:
- a first segment extending along the first edge of the substrate, wherein the first segment has a first width, the first width being a distance between an outer edge of the first segment and an inner edge of the first segment, wherein the first segment comprises an indentation extending at least partially through the ring structure, and wherein the indentation opens towards the first edge of the package component in the top view.
2 more elements
Dependencies are inferred from the claim text.