Shielded Semiconductor Package with Open Terminal and Methods of Making
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsChangOh Kim, KyoWang Koo, SungWon Cho, BongWoo Choi, JiWon Lee
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Abstract
A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
Claims25
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing an electrical component over a surface of the substrate;
- depositing an encapsulant over the electrical component and substrate, wherein a portion of the surface of the substrate remains exposed from the encapsulant;
- forming a shielding layer over the encapsulant;
- and
- removing a portion of the shielding layer to expose the portion of the surface of the substrate.
A method of making a semiconductor device, comprising:
- providing a substrate;
- depositing an encapsulant over a surface of the substrate, wherein a portion of the surface of the substrate including a plurality of contact pads is exposed from the encapsulant;
- forming a shielding layer over the encapsulant;
- and
- removing a portion of the shielding layer to expose the portion of the surface of the substrate.
A method of making a semiconductor device, comprising:
- providing a substrate;
- depositing an encapsulant over a first portion of a surface of the substrate;
- forming a shielding layer over the encapsulant and substrate;
- and
- removing a portion of the shielding layer over a second portion of the surface of the substrate, wherein the second portion of the surface of the substrate includes a plurality of contact pads.
A semiconductor device, comprising:
- a substrate;
- an encapsulant deposited over a first portion of the substrate;
- and
- a shielding layer formed over the encapsulant, wherein a second portion of the substrate is exposed from the encapsulant and shielding layer.
Dependencies are inferred from the claim text.