Heat spreader for use with a semiconductor device
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsSooHan PARK, HyeSun KIM, KyungEun KIM, YouJin SHIN
Life of this patent
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Abstract
Provided is a heat spreader for use with a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate. The heat spreader comprises: a main body defining a space for receiving the at least one semiconductor die; and two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other. When the heat spreader is mounted with the semiconductor device, the slots prevent the substrate from moving closer to or away from the main body.
Claims18
A heat spreader for use with a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate, the heat spreader comprising:
- a main body defining a space for receiving the at least one semiconductor die;
- and
- two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other;
- wherein when the heat spreader is mounted with the semiconductor device, the slots prevent the substrate from moving closer to or away from the main body.
A semiconductor assembly, comprising:
- a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate;
- and
- a heat spreader mounted with the semiconductor device, comprising:
- a main body defining a space for receiving the at least one semiconductor die;
- and
- two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other;
- wherein the slots prevent the substrate from moving closer to or away from the main body.
A method for making a semiconductor assembly, comprising:
- providing a semiconductor device, wherein the semiconductor device comprises a substrate and at least one semiconductor die mounted on the substrate;
- providing a heat spreader, wherein the heat spreader comprises:
- a main body defining a space for receiving the at least one semiconductor die;
- and
- two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other;
- and
- inserting the substrate into the slots, wherein the slots prevent the substrate from moving closer to or away from the main body.
Dependencies are inferred from the claim text.