Semiconductor package and method of providing surface temperature of semiconductor package

A method of providing a surface temperature of a semiconductor package including at least one semiconductor die that is packaged using molding material, the method comprising:

• setting an air temperature in a test chamber in which the semiconductor package is mounted for a burn-in test to a first reference temperature;
• measuring a first reference code value corresponding to the first reference temperature based on a temperature code indicating a junction temperature in the at least one semiconductor die while the air temperature is set to the first reference temperature, the temperature code being provided from a reference temperature measurement circuit integrated in the semiconductor package;
• setting the air temperature in the test chamber to a second reference temperature;
• measuring a second reference code value corresponding to the second reference temperature based on the temperature code while the air temperature is set to the second reference temperature;
• generating calibration information indicating a first mapping relationship between the first reference temperature and the first reference code value and a second mapping relationship between the second reference temperature and the second reference code value;
• determining a linear conversion function based on the calibration information;
• inputting a present code value of the temperature code to the linear conversion function and receiving an output value from the linear conversion function;
• and
• providing a present surface temperature of the semiconductor package corresponding to the output value of the linear conversion function.

A semiconductor package comprising:

• a base substrate;
• at least one semiconductor die stacked on the base substrate;
• molding material covering the base substrate and the at least one semiconductor die;
• a reference temperature measurement circuit integrated in the at least one semiconductor die and configured to generate a temperature code indicating a junction temperature in the at least one semiconductor die;
• and
• a calibration logic configured to generate a present surface temperature of the molding material based on a present reference code value of the temperature code and calibration information indicating mapping relationships between a plurality of reference temperatures and a plurality of reference code values of the temperature code respectively corresponding to the plurality of reference temperatures.