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US 2023/0402318 A1Published application
Via connection to backside power delivery network
AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Kisik Choi, SOMNATH GHOSH, Julien Frougier, Stuart Sieg, Kevin Shawn Petrarca
Life of this patent
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Abstract
A semiconductor structure including a middle-of-line contact, a backside power rail, and a contact via extending between the middle-of-line contact and the backside power rail, wherein the contact via comprises a first portion having a negative tapered profile and a second portion having a positive tapered profile.
Claims19
A semiconductor structure comprising:
- a middle-of-line contact;
- a backside power rail;
- and
- a contact via extending between the middle-of-line contact and the backside power rail, wherein the contact via comprises a first portion having a negative tapered profile and a second portion having a positive tapered profile.
1 more element
A semiconductor structure comprising:
- a middle-of-line contact;
- a backside power rail;
- and
- a contact via extending between the middle-of-line contact and the backside power rail, wherein an upper portion of the contact via comprises a positive tapered profile, and wherein a lower portion of the contact via comprises a negative tapered profile.
1 more element
A semiconductor structure comprising:
- a middle-of-line contact;
- a backside power rail;
- and
- a contact via extending between the middle-of-line contact and the backside power rail, wherein an upper portion of the contact via comprises a negative tapered profile, and wherein a lower portion of the contact via comprises a positive tapered profile.
1 more element
Dependencies are inferred from the claim text.