Apparatus for cleaning wafer

A wafer cleaning apparatus, comprising:

• a base;
• a roller installation table installed on the base;
• a wafer support unit disposed between the roller installation table and having a support roller for rotatably supporting a wafer;
• and
• a pressing roller installed on the roller installation table and above the wafer support unit, and configured to press opposite surfaces of the wafer,
• wherein the pressing roller is provided with a plurality of space portions configured to apply a pneumatic pressure on the opposite surfaces of the wafer.

A wafer cleaning apparatus, comprising:

• a base;
• a pair of first installation plates fixed at the base and erected vertically from the base;
• a first pressing roller rotatably connected to the pair of first installation plates, wherein the first pressing roller extends in a first direction and the pair of first installation plates are spaced apart from each other in the first direction;
• a pair of second installation plates fixed at the base and erected vertically from the base, wherein the pair of second installation plates are spaced apart from the pair of first installation plates in a second direction perpendicular to the first direction;
• a second pressing roller rotatably connected to the pair of second installation plates, wherein the second pressing roller extends in the first direction and is spaced apart from the first pressing roller in the second direction;
• and
• a plurality of support rollers disposed between the base and a gap between the first and second pressing rollers, wherein the plurality of support rollers are controlled to rotate in a same direction.