Plasma preclean system for cluster tool

A plasma processing system for cleaning a substrate comprising:

• a process chamber, comprising:
• a chamber body enclosing an interior volume;
• and
• a substrate support disposed in the interior volume;
• a gas source fluidly coupled to the interior volume;
• a first supply line fluidly coupled between the interior volume and the gas source;
• and
• a second supply line fluidly coupled between the interior volume and the gas source, wherein
• the first supply line and the second supply line are arranged to provide alternative paths between the interior volume and the gas source, and
• the first supply line has an internal diameter that is at least 50% smaller than the internal diameter of the second supply line.

A cluster tool for processing a semiconductor substrate, comprising:

• a transfer chamber;
• a deposition chamber coupled to the transfer chamber;
• and
• a plasma processing system coupled to the transfer chamber, the plasma processing system comprising:
• a process chamber comprising:
• a chamber body enclosing an interior volume;
• and
• a substrate support disposed in the interior volume;
• a vacuum pump;
• a first exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump;
• and
• a second exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump, wherein
• the first exhaust line and the second exhaust line are arranged to provide alternative paths for the exhaust between the interior volume and the vacuum pump.