Electronic device

An electronic device, comprising:

• a ceramic element including a first electrode portion and a second electrode portion;
• a first metal terminal including a first electrode connection portion and a first external connection portion, the first electrode connection portion being connected to the first electrode portion through solder;
• and
• a second metal terminal including a second electrode connection portion and a second external connection portion, the second electrode connection portion being connected to the second electrode portion through solder, wherein
• the first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion, and
• the second electrode connection portion includes a second solder stopper formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion to control a range of an adhesion region of solder to the second electrode portion.