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US 2023/0400648 A1Published application
Electronic package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHan-Chee YEN, Min-Yao CHENG, Hung-Yi LIN
Life of this patent
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Abstract
The present disclosure provides an electronic package. The electronic package includes a photonic component including a first input/output (I/O) port and a second I/O port both at a side of the photonic component. The electronic package also includes a connector disposed adjacent to the side of the photonic component and configured to guide a first light carrying medium to be optically coupled with at least one of the first I/O port and second I/O port of the photonic component.
Claims20
An electronic package, comprising:
- a photonic component including a first input/output (I/O) port and a second I/O port both at a side of the photonic component;
- and
- a connector disposed adjacent to the side of the photonic component and configured to guide a first light carrying medium to be optically coupled with at least one of the first I/O port and second I/O port of the photonic component.
An electronic package, comprising:
- a carrier;
- an optical transceiver disposed over the carrier, the optical transceiver including a surface facing away from the carrier;
- and
- a plurality of light carrying mediums disposed on the surface of the optical transceiver along at least two dimensions.
1 more element
An electronic package, comprising:
- a connector having an opening;
- an I/O port disposed within the opening from a top view;
- and
- a first set of conductive pillars electrically connected to the connector,
- wherein the first set of conductive pillars are configured to maintain a distance between a top surface of the connector and the I/O port.
2 more elements
Dependencies are inferred from the claim text.