Plating apparatus and plating method

Abstract

Provided are a plating apparatus and a plating method for preventing or mitigating electric field diversion irrespective of the physical or mechanical structure. According to one embodiment, provided is a plating apparatus comprising: a substrate holder configured so as to hold a substrate; a plating bath configured so as to accommodate the substrate holder which holds the substrate, and provided with a first tank on a first surface side of the substrate and a second tank on a second surface side of the substrate, the first tank and the second tank communicating with each other with a gap therebetween; a first anode electrode arranged in the first tank of the plating bath; a first power source configured so as to supply a plating current between the substrate and the first anode electrode; an auxiliary anode electrode arranged on the first tank side of the gap; an auxiliary cathode electrode arranged on the second tank side of the gap; and an auxiliary power source configured so as to supply an auxiliary current between the auxiliary anode electrode and the auxiliary cathode electrode.

Dependencies are inferred from the claim text.