Commercially Viable Biosensor Manufacture
OwnerRichard Postrelinventor
Life of this patent
Estimating the term…
Abstract
This invention provides systems and methods for improved biosensor production resulting in enhanced surface adhesion with stronger dielectrics and reduced inter-sensor variance. The present invention greatly improves both the reliability and depth of data obtained. These greatly improved biosensors are ideally suited for the detection of early stage diseases and conditions such as cancers, pathogens, and toxic exposures. Practicing this invention allows for commercially viable manufacturing and the refurbishing of spent biosensors.
Claims20
A method for producing a highly sensitive, highly selective sensing chip, said method comprising:
- depositing with physical layer deposition a layer of aluminum on a chip substrate, wherein thickness of said layer of aluminum is between 1 nm and 5 nm;
- exposing said layer to an oxygen source wherein aluminum in said aluminum layer is oxidized to form Al2O3;
- performing a plurality of atomic layer deposition (ALD) cycles to build a HfO2 dielectric layer between about 20 nm and about 80 nm on the Al2O3;
- annealing said chip;
- applying a composition comprising single wall carbon nanotubes to form a coating on the HfO2 dielectric;
- and
- applying a sensitivity functionalizing compound to said coating.
A method for producing a highly sensitive, highly selective sensing chip, said method comprising:
- depositing with physical layer deposition a layer of aluminum on a chip substrate, wherein thickness of said layer of aluminum is between 1 nm and 5 nm;
- exposing said layer to an oxygen source wherein aluminum in said aluminum layer is oxidized to form Al2O3;
- performing a plurality of atomic layer deposition (ALD) cycles to build a HfO2 dielectric layer between about 20 nm and about 80 nm on the Al2O3;
- annealing said chip;
- applying a graphene composition to form a carbon composition coating on the HfO2 dielectric;
- and
- applying a sensitivity functionalizing compound to the carbon composition coating.
A method for producing a highly sensitive, highly selective sensing chip, said method comprising:
- performing a plurality of atomic layer deposition (ALD) cycles to form Al2O3 on a chip substrate to achieve Al2O3 thickness between ˜10 and 50 nm;
- performing a plurality of atomic layer deposition (ALD) cycles to build on the Al2O3, a HfO2 dielectric layer between about 20 and 80 nm;
- annealing said chip:
- applying a single wall carbon nanotube composition to form a carbon composition coating on the HfO2 dielectric;
- and
- applying a sensitivity functionalizing compound to the carbon composition coating.
The method of claim 19 wherein said ALD cycles comprise introduction of water or ozone following introduction of a HfO2 precursor.
A method producing a highly sensitive, highly selective sensing chip, said method comprising performing a plurality of atomic layer deposition (ALD) cycles to coat a chip base said plurality of ALD cycles comprising:
- a) a first deposition cycle of precursor A reaction to saturation and flush and precursor B reaction and flush performed in a chamber environment at about 150° C.;
- b) a second deposition cycle of precursor A reaction to saturation and flush and precursor B reaction and flush performed in a chamber environment at temperature about 200° C. or higher;
- c) repetition of a) and b) a number of time to bring the thin film to a desired thickness;
- before
- d) a final deposition cycle of precursor A reaction to saturation and flush and precursor B reaction and flush performed in a chamber environment at about 150° C.
Dependencies are inferred from the claim text.