Film forming method and atmospheric plasma film forming apparatus
AssigneeFUJIFILM Corporation
InventorsAkihisa YOSHIDA, Yoshihiko MOCHIZUKI
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AssigneeFUJIFILM Corporation
InventorsAkihisa YOSHIDA, Yoshihiko MOCHIZUKI
Estimating the term…
An object of the present invention is to provide a film forming method and an atmospheric plasma film forming apparatus capable of forming a film having high flatness at a high film forming speed by using atmospheric plasma film formation. The object is achieved by introducing plasma generation gas from an inner side flow passage that passes between a pair of electrodes, by introducing raw material gas from at least one of a first outer side flow passage or a second outer side flow passage that pass through an outer side of the pair of electrodes, and by making a gas flow rate between an outlet port of the first outer side flow passage and a substrate and a gas flow rate between an outlet port of the second outer side flow passage and the substrate unequal.
A film forming method comprising:
An atmospheric plasma film forming apparatus comprising:
Dependencies are inferred from the claim text.