Thermally conductive silicone composition and thermally conductive member
AssigneeDow Toray Co., Ltd.
InventorKenji OTA
Life of this patent
Estimating the term…
Loading patent…
AssigneeDow Toray Co., Ltd.
InventorKenji OTA
Estimating the term…
A thermally conductive silicone composition comprises: (A) an organopolysiloxane having on average at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having on average at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler comprising: (D-1) a thermally conductive powder other than an aluminum nitride powder, the thermally conductive powder having a specific average particle diameter, (D-2) an aluminum nitride powder having a specific average particle diameter, and (D-3) a spherical aluminum oxide powder and/or a spherical magnesium oxide powder having a specific average particle diameter, respectively; and (E) a specific surface treating agent or wetting agent. The thermally conductive silicone composition has favorable handling and filling properties and cures to form a thermally conductive member having high thermal conductivity and in which the occurrence of internal cracks under high temperatures is suppressed.
A thermally conductive silicone composition comprising:
Dependencies are inferred from the claim text.