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US 2023/0399554 A1Published application
Epoxy resin adhesive for medical device and cured product of the same, and medical device member and medical device
AssigneeFUJIFILM Corporation
InventorsKazushi FURUKAWA, Yoshihiro NAKAI
Life of this patent
Estimating the term…
Abstract
Provided are an epoxy resin adhesive for a medical device and its cured product, and a medical device member and a medical device. The epoxy resin adhesive includes the following components (A) to (C): (A) an epoxy resin; (B) a polyamine compound having two or more unsubstituted amino groups; and (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group.
Claims11
An epoxy resin adhesive for a medical device, the epoxy resin adhesive comprising the following components (A) to (C):
- (A) an epoxy resin;
- (B) a polyamine compound having two or more unsubstituted amino groups;
- and
- (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group.
1 more element
Dependencies are inferred from the claim text.