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US 2023/0399552 A1Published application
Adhesive for pellicle, pellicle for photo mask and method for manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMun Ja KIM, Changyoung JEONG
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Abstract
An adhesive for a pellicle, the adhesive including a phenol compound, the phenol compound having at least two hydroxyl groups, a polymer having a hydroxyl group or an amine group, and water.
Claims18
A method of fabricating a photo mask assembly, the method comprising:
- combining a frame with a pellicle membrane by providing an adhesive between the frame and the pellicle membrane;
- and
- combining the frame with a photo mask,
- wherein the adhesive consists of about 0.01 M to about 0.2 M of pyrogallol, about 1% to about 20% by weight of polyethylene imine having weight average molecular weight of about 25,000 to about 750,000, about 0.001% to about 0.1% by weight of silica particles, and a remainder of water,
- wherein the pellicle membrane includes one or more of silicon, a carbon material, a semiconductive material, or a fluorine-containing polymer,
- wherein the frame includes a metal,
- wherein an adhesive layer formed from the adhesive has a bond strength about 7 kgf/cm2 to about 20 kgf/cm2.
4 more elements
A method of fabricating a photo mask assembly, the method comprising:
- combining a frame with a pellicle membrane by providing an adhesive between the frame and the pellicle membrane;
- and
- combining the frame with a photo mask,
- wherein the adhesive consists of about 1% to about 30% by weight of tannic acid, about 20% to about 40% by weight of polyvinylalcohol, about 0.05% to about 1% by weight of silica particles, and a remainder of water without either an additional curing agent or an additional cross-linking agent,
- wherein the pellicle membrane includes one or more of silicon, a carbon material, a semiconductive material, or a fluorine-containing polymer,
- wherein the frame includes a metal,
- wherein an adhesive layer formed from the adhesive has a bond strength about 7 kgf/cm2 to about 20 kgf/cm2,
- wherein the adhesive layer has a cross-linked structure formed by hydrogen bonds between the tannic acid and the polyvinylalcohol such that the adhesive layer is soluble by solvent.
5 more elements
A method of manufacturing a semiconductor device, the method comprising:
- providing a light to a photo mask assembly including a photo mask, a pellicle membrane, a frame disposed between the photo mask and the pellicle membrane and an adhesive layer combining the frame with the pellicle membrane,
- wherein the adhesive layer is formed from an adhesive consisting of about 1% to about 30% by weight of tannic acid, about 20% to about 40% by weight of polyvinylalcohol, about 0.05% to about 1% by weight of silica particles, and a remainder of water without either an additional curing agent or an additional cross-linking agent,
- wherein the pellicle membrane includes one or more of silicon, a carbon material, a semiconductive material, or a fluorine-containing polymer,
- wherein the frame includes a metal,
- wherein the adhesive layer has a bond strength about 7 kgf/cm2 to about 20 kgf/cm2.
2 more elements
Dependencies are inferred from the claim text.