Bonding film for high-speed communication board

Abstract

Provided is a bonding film for a high-speed communication board that is superior in adhesion to a conductor layer without requiring a specifical treatment process for improving an adhesiveness between the smooth conductor layer and an insulation layer in the production of a circuit board such as a multilayered printed-wiring board and a flexible printed-wiring board. The bonding film is a curable adhesive layer-containing bonding film for a high-speed communication board, which includes: a curable resin composition layer containing a curable resin composition; and a curable adhesive composition layer that is laminated on one or both surfaces of the curable resin composition layer, contains a bismaleimide resin-containing curable adhesive composition, and has a thickness of 1 to 100 μm.

Dependencies are inferred from the claim text.