Conductive aqueous ink composition for filling in engraved micropattern, conductor-filled micropattern fabricated using same, and conductive device including same

Abstract

The present disclosure relates to a conductive aqueous ink composition for filling in an engraved micropattern, conductor-filled micropatterns fabricated using same, and a conductive device comprising same, wherein the conductive aqueous ink composition is conductive aqueous ink to be used for filling in an engraved micropattern formed on a substrate and can be applied to plastic bases, etc., and improve working environments due to low temperature sintering. The ink composition comprises: metal nanoparticles (A) protected by a dispersion stabilizer and ranging in particle size from 5 to 50 nm, metal particles (B) ranging in particle size from 100 to 900 nm; and a water-soluble solvent (C) having a boiling point of at least 150° C., the dispersion stabilizer containing a protective polymer composed of branched polyalkylene imine segments and polyoxyalkylene segments and an amine acid salt composed of an amine and an inorganic acid.

Dependencies are inferred from the claim text.