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US 2023/0399492 A1Published application
Underfill composition, coating film, cured film, multilayer interconnection board, and manufacturing method of multilayer interconnection board
AssigneeFUJIFILM Corporation
InventorJunji KAWAGUCHI
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Abstract
An object of the present invention is to provide an underfill composition having excellent temporal stability and good metal adhesiveness, a coating film formed of the underfill composition, a cured film, a multilayer interconnection board, and a manufacturing method of a multilayer interconnection board. The underfill composition of the present invention is an underfill composition containing a polymer and a maleimide compound having a maleimide group, in which the polymer has a cyano group, and a content of the cyano group included in 1 g of the polymer is 0.1 to 6 mmol/g.
Claims21
An underfill composition comprising:
- a polymer;
- and
- a maleimide compound having a maleimide group,
- wherein the polymer has a cyano group, and
- a content of the cyano group included in 1 g of the polymer is 0.1 to 6 mmol/g.
2 more elements
Dependencies are inferred from the claim text.