Resin composition for encapsulating semiconductor element-mounted surface of substrate with semiconductor element mounted thereon or semiconductor element-forming surface of wafer with semiconductor element formed thereon, and use thereof

Abstract

Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; (B) a reaction initiator; and (C) an inorganic filler surface-treated with a silane coupling agent, wherein the component (C) has a maximum particle size of not larger than 40 μm.

Dependencies are inferred from the claim text.