US 2023/0398802 A1 · SYSTEMS AND METHODS FOR PRINTING METAL LINES AND PATTERNS AT HIGH RESOLUTION

Abstract

A solvent layer is coated on a metal layer carried by a donor substrate, allowing the fabrication of solid metal lines at a high resolution. The laser jetting involves ejecting metal particles, constrained within a solvent membrane, from the metal layer. Once the metal particles have been deposited onto a receiver substrate, the solvent can be evaporated. Since this printing procedure can be performed with the solvent layer in direct contact with the receiver substrate or separated therefrom by a small distance, the resolution of the metal lines can be very high and depends directly on the laser spot size and defocus. The solvent constrains the droplet size of the metal particles, which can increase or maintain the resolution of the laser beam. As this process is a continuous sequence production, the metal line production can be performed at a very rapid rate.

Claims17

Dependent claims

A printing system, comprising:

a donor substrate;
a coating unit configured to coat a surface of the donor substrate with a metal layer and to coat a surface of the metal layer with a solvent layer;
and
a printing unit configured to direct a laser beam towards the donor substrate so as to jet metal particles from the metal layer towards a receiver substrate, wherein the metal particles are constrained within a solvent membrane formed by the solvent layer while being jetted towards the receiver substrate.

1 more element

Dependencies are inferred from the claim text.

Systems and methods for printing metal lines and patterns at high resolution

Life of this patent

Systems and methods for printing metal lines and patterns at high resolution

Life of this patent

Abstract

Claims17