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US 2023/0398643 A1Published application
Solder alloy, solder ball and solder joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsYuki IIJIMA, Shunsaku YOSHIKAWA, Kanta DEI, Takahiro MATSUFUJI, Kota SUGISAWA
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Abstract
The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.
Claims21
A solder alloy which is free from lead and antimony, the solder alloy having an alloy constitution consisting of:
- 1.0% by mass to 4.0% by mass of Ag;
- 0.1% by mass to 1.0% by mass of Cu;
- 0.1% by mass to 9.0% by mass of Bi;
- 0.005% by mass to by mass of Ni;
- 0.001% by mass to 0.015% by mass of Ge;
- optionally 0.001% by mass to 0.1% by mass of Co;
- and a balance of Sn.
4 more elements
-22. (canceled)
-27. (canceled)
-33. (canceled)
(canceled)
Dependencies are inferred from the claim text.