System, control method and apparatus for chemical mechanical polishing

A control method for chemical mechanical polishing apparatus having a polishing pad, a sensor, a polishing head and a conditioner, the control method comprising:

• capturing, by the sensor, images of the polishing pad to obtain surface roughness of the polishing pad;
• tuning at least one polishing condition according to the surface roughness of the polishing pad;
• polishing a wafer which is push against the polishing pad by the polishing head;
• and
• reconditioning, by the conditioner, the polishing pad according to the at least one polishing condition.

A chemical mechanical polishing system, comprising:

• a chemical mechanical polishing apparatus, comprising:
• a polishing pad;
• a sensor configured to obtain surface roughness of the polishing pad;
• a polishing head located above the polishing pad and configured to polish a wafer which is push against the polishing pad;
• and
• a conditioner located on the polishing pad and configured to recondition the polishing pad;
• and
• a controller coupled to the chemical mechanical polishing apparatus, and is configured to tune at least one polishing condition according to the surface roughness of the polishing pad and control the conditioner according to the at least one polishing condition.