Jet soldering apparatus
AssigneeSenju Metal Industry Co., Ltd.
InventorsHirokazu ICHIKAWA, Kenichi TOMITSUKA
Life of this patent
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Abstract
A jet soldering apparatus has a first housing; a first supply port provided on the first housing and configured to provide molten solder; a second housing; and a second supply port provided on the second housing and configured to provide the molten solder. The molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed. The mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.
Claims14
A jet soldering apparatus comprising:
- a first housing;
- a first supply port provided on the first housing and configured to provide molten solder;
- a second housing;
- and
- a second supply port provided on the second housing and configured to provide the molten solder,
- wherein the molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed, the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port,
- wherein an upper surface of the mixed molten solder is not positioned below a lower end of a conveyance rail that conveys the substrate in an entire length region along a substrate conveyance direction between the first supply port and the second supply port, and
- wherein a place where the molten solder falls is not provided between the first supply port and the second supply port along the substrate conveyance direction.
A jet soldering apparatus comprising:
- a first housing;
- a first supply port provided on the first housing and configured to provide molten solder;
- a second housing;
- a second supply port provided on the second housing and configured to provide the molten solder;
- a first drive unit giving a driving force to the molten solder provided from the first supply port;
- and
- a second drive unit giving a driving force to the molten solder provided from the second supply port,
- wherein the molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed, the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port, and
- wherein a place where the molten solder falls is not provided between the first supply port and the second supply port along a substrate conveyance direction.
A jet soldering apparatus comprising:
- a first housing;
- a first supply port provided on the first housing and configured to provide molten solder;
- a second housing;
- and
- a second supply port provided on the second housing and configured to provide the molten solder;
- wherein the molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed, the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port, and
- wherein a width of an installation region of the second supply port along a substrate conveyance direction is smaller than a width of an installation region of the first supply port along the substrate conveyance direction, and
- wherein a place where the molten solder falls is not provided between the first supply port and the second supply port along the substrate conveyance direction.
(canceled)
Dependencies are inferred from the claim text.