Substrate treating apparatus and substrate treating method

A substrate treating apparatus for treating a substrate, comprising:

• a process tank configured to store a treatment liquid;
• a chamber configured to surround the process tank;
• a solvent vapor nozzle configured to supply solvent vapor into the chamber;
• a cleaning liquid nozzle configured to supply a cleaning liquid into the chamber;
• and
• a controller,
• the controller causing immersion treatment, where a substrate is immersed in the treatment liquid stored in the process tank, to be performed for a preset period of time, and causing dry treatment, where the substrate processed with the treatment liquid and taken out of the process tank is dried with the solvent vapor supplied from the solvent vapor nozzle, to be performed, and
• the controller causing the cleaning liquid nozzle to supply the cleaning liquid into the chamber and causing the process tank to be immersed in the cleaning liquid stored in the chamber, thereby causing chamber cleaning treatment, where the chamber including an outer wall of the process tank is cleaned, to be performed.