Systems and methods for shielded inductive devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng Wei KUO, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski
Life of this patent
Estimating the term…
Abstract
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Claims20
A circuit, comprising:
- a transformer formed within a first layer;
- a grounded shield formed within a second layer separate from the first layer;
- and
- a circuit component formed within a third layer separate from the second layer, wherein:
- the circuit component is coupled with the transformer through the second layer,
- the third layer is separated from the first layer by the second layer, and
- the circuit component is laterally surrounded by winding structures of the transformer.
A circuit, comprising:
- an inductor defining an inductive footprint within a first layer;
- a grounded shield formed within a second layer separate from the first layer;
- and
- a circuit component laterally bounded by the inductive footprint so as to be surrounded by an outer perimeter of the inductive footprint, wherein the circuit component is formed within a third layer separate from the second layer, wherein:
- the circuit component is coupled with the inductor,
- the third layer is separated from the first layer by the second layer, and
- the circuit component is laterally surrounded by winding structures of the transformer.
A circuit, comprising:
- an inductor defining an inductive footprint within a first layer;
- a grounded shield formed within a second layer separate from the first layer;
- and
- a circuit component laterally bounded by the inductive footprint so as to be surrounded by an outer perimeter of the inductive footprint, wherein the circuit component is formed within a third layer separate from the second layer, wherein:
- the circuit component is coupled with the inductor,
- the third layer is separated from the first layer by the second layer,
- the circuit component is laterally surrounded by winding structures of the transformer, and
- the first layer, the second layer, and the third layer are metallization layers of an integrated circuit.
Dependencies are inferred from the claim text.