Solid-state image pickup device and electronic apparatus
AssigneeSony Group Corporation
InventorsAtsushi MASAGAKI, Yusuke TANAKA
Life of this patent
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Abstract
The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.
Claims20
A solid-state image pickup device, comprising:
- a plurality of pixels that perform photoelectric conversion on light, the light entering the respective pixels from a back surface of the solid-state image pickup device via different lenses for each pixel;
- a pixel separation wall formed between the pixels adjacent to each other;
- and
- a wiring layer provided on a front surface of the solid-state image pickup device, wherein
- the pixel separation wall includes a front-side trench formed from the front surface and a backside trench formed from the back surface.
The solid-state image pickup device according to pixels adjacent in a predetermined direction includes two front-side trenches and the backside trench, the two front-side trenches sandwiching a well electrode, no floating diffusion being shared by the pixels, and a position on the back surface of the backside trench corresponds to a position of the well electrode.
The solid-state image pickup device according to pixels sharing a floating diffusion includes the front-side trench and the backside trench, the front-side trench being formed in an area on the front surface between the pixels, no floating diffusion being formed in the area, the backside trench being formed in the entire area on the back surface between the pixels, and the front-side trench and the backside trench are in contact with each other.
An electronic apparatus, comprising:
- a solid-state image pickup device including
- a plurality of pixels that perform photoelectric conversion on light, the light entering the respective pixels from a back surface of the solid-state image pickup device via different lenses for each pixel,
- a pixel separation wall formed between the pixels adjacent to each other, and
- a wiring layer provided on a front surface of the solid-state image pickup device, wherein
- the pixel separation wall includes a front-side trench formed from the front surface and a backside trench formed from the back surface.
Dependencies are inferred from the claim text.