High performance two-phase cooling apparatus for portable applications
AssigneePiMEMS, Inc.
InventorPayam BOZORGI
Life of this patent
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Abstract
The present application discloses two-phase cooling devices that may include at least three substrates, a metal with a wicking structure, an intermediate substrate, and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.
Claims20
A thermal ground plane for use in an enclosure, comprising:
- a vapor region and a liquid region for a working fluid, wherein said thermal ground plane includes a backplane;
- a vapor cavity and a wicking structure formed on a metal substrate and wherein said thermal ground plane includes an intermediate substrate with a plurality of protrusions disposed in said vapor cavity adjacent to said wicking structure, wherein said plurality of protrusions are coupled to each other by at least one cross member and wherein said protrusions fit conformally into said wicking structure and wherein said backplane includes supporting pillars that mechanically support a spacing between said backplane, said wicking structure and said intermediate substrate, and structurally support said thermal ground plane;
- an integrated circuit chip disposed within the enclosure, wherein the integrated circuit chip is in thermal communication with the thermal ground plane such that heat generated by the chip is distributed throughout the portable device by the thermal ground plane;
- and
- wherein the thermal ground plane is in thermal communication with at least one structural element of the portable device, and wherein the thermal ground plane is mechanically coupled to the portable device.
A thermal ground plane comprising:
- a vapor region and a liquid region for a working fluid disposed within said thermal ground plane, said thermal ground plane including a backplane opposite a metal substrate;
- a wicking structure formed on said metal substrate and said thermal ground plane including an intermediate substrate with a plurality of protrusions disposed in said vapor cavity adjacent to said wicking structure, wherein said plurality of protrusions are coupled to each other by at least one cross member and wherein said protrusions fit conformally into said wicking structure and wherein said backplane includes supporting pillars that mechanically support a spacing between said backplane and said wicking structure, and said pillars structurally support said thermal ground plane.
A thermal ground plane comprising:
- a vapor region and a liquid region for a working fluid disposed within said thermal ground plane, said thermal ground plane including a backplane opposite a metal substrate;
- said thermal ground plane including an intermediate substrate with a plurality of protrusions disposed in said vapor cavity adjacent to said metal substrate;
- and
- wherein said backplane includes supporting pillars that mechanically support a spacing between said backplane, said metal substrate, and said pillars structurally support said thermal ground plane.
Dependencies are inferred from the claim text.