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US 2023/0380764 A1Published application
Pressure sensing implant
AssigneeEndotronix, Inc.
InventorsHarry ROWLAND, Michael NAGY, Balamurugan SUNDARAM, Suresh SUNDARAM
Life of this patent
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Abstract
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Claims24
A circuit comprising:
- a housing comprising a plurality of walls defining a first cavity and an opening;
- a sensor connected to the housing at the opening, the sensor comprising:
- a lid wafer comprising an electrode;
- and
- a base wafer comprising an electrode, wherein the base wafer is positioned entirely within the first cavity and the base wafer is bonded to the lid wafer, the lid wafer and base wafer defining a second cavity, wherein the second cavity comprises a port to allow fluid communication with the first cavity.
2 more elements
A circuit comprising:
- a housing comprising a plurality of walls defining a cavity and an opening;
- a sensor connected to the housing at the opening to form a hermetic seal, the sensor comprising:
- a lid wafer having a first surface and a second surface wherein the first surface is exposed to an exterior of the housing, and an electrode positioned on the second surface of the lid wafer;
- a base wafer having a first surface bonded to the second surface of the lid wafer and having an electrode positioned on the first surface of the base wafer;
- and
- wherein the base wafer is positioned entirely within the cavity and the electrode pm the lid wafer comprises slots or breaks that result in a non-continuous solid area for preventing formation of eddy currents during use of the sensor.
3 more elements
A circuit comprising:
- a housing defining a cavity and an opening;
- a capacitive plate positioned on a lid wafer, wherein the lid wafer comprises a first surface, an opposite second surface and an electrode positioned on the second surface;
- a second capacitive plate positioned on a base wafer, wherein the base wafer comprises a first surface and an opposite second surface, the second capacitive plate is positioned on the first surface and a portion of the first surface of the base wafer is bonded to the second surface of the lid wafer forming a sensor;
- and
- an electronic assembly inserted within the cavity of the housing, wherein the sensor is bonded to the opening of the housing and the base wafer is positioned within the cavity defined by the housing.
2 more elements
A circuit comprising:
- a housing comprising a plurality of walls defining a first cavity and an opening;
- a sensor connected to the housing at the opening, the sensor comprising:
- a lid wafer comprising an electrode;
- a base wafer comprising an electrode, wherein the base wafer is positioned entirely within the first cavity and the base wafer is bonded to the lid wafer, the lid wafer and base wafer defining a second cavity;
- and
- an electrical via electrically connecting the electrode of the base wafer to a contact on an other side of the base wafer.
3 more elements
Dependencies are inferred from the claim text.