Semiconductor device testing apparatus and methods of testing and fabricating semiconductor device using the same

A method of fabricating a semiconductor device, comprising:

• transmitting an ultrasonic wave to a substrate;
• disposing an ultrasonic wave receiving probe through an aperture at a first reception position on a surface of the substrate;
• moving the ultrasonic wave receiving probe and disposing the moved ultrasonic wave receiving probe through an aperture at a second reception position on the surface;
• and
• receiving a reflection ultrasonic wave, which is reflected by a portion in the substrate,
• wherein the receiving of the reflection ultrasonic wave comprises one of:
• receiving a first reflection ultrasonic wave at the first reception position using the ultrasonic wave receiving probe;
• and
• receiving a second reflection ultrasonic wave at the second reception position using the moved ultrasonic wave receiving probe,
• wherein the first reception position and the second reception position are spaced apart from each other in a horizontal direction.

A method of testing a semiconductor device, comprising:

• transmitting an ultrasonic wave to a substrate;
• and
• receiving a reflection ultrasonic wave, which is reflected by a portion in the substrate,
• wherein the receiving of the reflection ultrasonic wave comprises:
• disposing an aperture on a surface of the substrate;
• and
• receiving the reflection ultrasonic wave, which is transmitted through the aperture, using an ultrasonic wave receiving probe positioned on the surface of the substrate.