Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing

An electronic device manufacturing system, comprising:

• a memory device;
• and
• a processing device, operatively coupled to the memory device, to perform operations comprising:
• obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate;
• obtaining an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the process recipe;
• generating a correction profile based on the metrology data and the expected profile, wherein the correction profile comprises a deposition time offset value for at least one layer of the plurality of layers;
• generating an updated process recipe by applying the correction profile to the process recipe;
• and
• causing a deposition step to be performed on the substrate according to the updated process recipe.

A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device operatively coupled to a memory, performs operations comprising:

• obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate;
• obtaining an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the process recipe;
• generating a correction profile based on the metrology data and the expected profile, wherein the correction profile comprises a deposition time offset value for at least one layer of the plurality of layers;
• generating an updated process recipe by applying the correction profile to the process recipe;
• and
• causing a deposition step to be performed on the substrate according to the updated process recipe.