A method and system for manufacturing an embossing device by using an etch mask

A method for manufacturing a structured embossing cylinder for an embossing system comprising the steps of:

• providing a hard-coated embossing roller having a cylindrically shaped core and a structure-bearing layer on the cylindrically shaped core, by a first (Plasma-Enhanced) Vapor Deposition in a vacuum chamber, the structure-bearing layer having a thickness in a range between 1 μm and 10 μm, and having a surface-roughness value Ra of less than 100 nm;
• depositing a hard-masking layer on the structure-bearing layer, by a second (Plasma-Enhanced) Vapor Deposition, the hard-masking layer having a thickness of equal or less than 100 nm;
• performing e-beam writing into a provided e-beam resist layer on top of the hard-masking layer;
• developing and removing e-beam resist layer to exposing the hard-masking layer;
• etching the hard-masking layer with an etchant that does not affect the structure-bearing layer;
• and
• etching the structure-bearing layer to form a surface cavity into the structure-bearing layer, the surface cavity forming a structural embossing feature into the structure-bearing layer.

A structured embossing device comprising:

• a base;
• an adhesion layer on the base;
• a structure-bearing layer on the adhesion layer having a thickness in a range between 1 μm and 10 μm and an Ra roughness value of less than 100 nm;
• an inorganic hard-masking layer on the structure-bearing layer having a thickness of less than 100 nm;
• and
• an embossing structuration arranged in a surface of the structure-bearing layer, the embossing structuration traversing the hard-masking layer, and
• wherein a depth of a surface cavity formed by the embossing structuration is between 50 nm and 7 μm, and a width of the surface cavity is between 100 nm and 10 μm.

An injection mold comprising:

• a base;
• an adhesion layer on the base;
• a structure-bearing layer on the adhesion layer having a thickness in a range between 1 μm and 10 μm and an Ra roughness value of less than 100 nm;
• an inorganic hard-masking layer on the structure-bearing layer having a thickness of less than 100 nm;
• and
• a molding cavity arranged in a surface of the structure-bearing layer, the molding cavity traversing the hard-masking layer, and
• wherein a depth of a surface opening formed by the molding cavity is between 50 nm and 7 μm, and a width of the surface cavity is between 100 nm and 10 μm.