Method and System for Electroplating Parts with Metal
AssigneeDipsol Chemicals Co., Ltd.
InventorsToshihiro NIIKURA, Alec CHAFFEE, Tarek NAHLAWI, Shuntaro TSUKIYAMA
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AssigneeDipsol Chemicals Co., Ltd.
InventorsToshihiro NIIKURA, Alec CHAFFEE, Tarek NAHLAWI, Shuntaro TSUKIYAMA
Estimating the term…
An object of the present invention is to provide a method and system of electroplating using an anode that can be prepared relatively easily without the need for ancillary equipment or anolyte management, and without the need for expensive metals or special metals. The present invention relates to a method of electroplating an article with metal, the method comprising the steps of: allowing a current to flow in a plating bath containing ions of the metal and an organic compound additive, wherein the plating bath comprises the article as a cathode and a conductive base material as an anode, a part of a surface of the conductive base material is covered with an insulating material, and a remaining part is exposed, and a current flowing portion is dispersedly present in the anode.
Are the method of electroplating an article with metal, and it includes the process energized in the plating bath containing the ion and organic compound additive agent of the aforementioned metal, The aforementioned plating bath was provided with the aforementioned article as an anode, and is provided with the conductive base material as a cathode, A method which a part of surface of the aforementioned conductive base material was covered with the insulating material, and has exposed other parts, and an energized part distributes the layer of the aforementioned insulating material in a series of the not a thing but aforementioned cathodes in the surface of the aforementioned conductive base material, and exists.
Are the method of electroplating an article with metal, and it includes the process energized in the plating bath containing the ion and organic compound additive agent of the aforementioned metal, The aforementioned plating bath was provided with the aforementioned article as an anode, and is provided with the conductive base material as a cathode, The aforementioned plating bath is an alkaline plating bath, and a part of surface of the aforementioned conductive base material is covered with an insulating material, A way have exposed other parts, and the energized part distributes and exists in the aforementioned cathode (however, the aforementioned conductive base material removes the mode covered with the state which can be energized with alkali-proof ceramics).
Are the method of electroplating an article with metal, and it includes the process energized in the plating bath containing the ion and organic compound additive agent of the aforementioned metal, The aforementioned plating bath was provided with the aforementioned article as an anode, and is provided with the conductive base material as a cathode, A way a part of surface of the aforementioned conductive base material was covered with the insulating material, have exposed other parts, and the energized part distributes and exists.
With metal, are an article a system to electroplate and The ion of the aforementioned metal, The aforementioned plating bath is provided with the aforementioned article as an anode including the plating bath containing an organic compound additive agent, And the system which it has the conductive base material as a cathode, and a part of surface of the aforementioned conductive base material was covered with the insulating material, and has exposed other parts, and an energized part distributes the layer of the aforementioned insulating material in a series of the not a thing but aforementioned cathodes in the surface of the aforementioned conductive base material, and exists.
With metal, are an article a system to electroplate and The ion of the aforementioned metal, The aforementioned plating bath is provided with the aforementioned article as an anode including the plating bath containing an organic compound additive agent, And it has the conductive base material as a cathode, and the aforementioned plating bath is an alkaline plating bath, The system which a part of surface of the aforementioned conductive base material was covered with the insulating material, and has exposed other parts, and an energized part distributes and exists in the aforementioned cathode (however, the aforementioned conductive base material removes the mode covered with the state which can be energized with alkali-proof ceramics).
With metal, are an article a system to electroplate and The ion of the aforementioned metal, The aforementioned plating bath is provided with the aforementioned article as an anode including the plating bath containing an organic compound additive agent, And the system which it has the conductive base material as a cathode, and a part of surface of the aforementioned conductive base material was covered with the insulating material, and has exposed other parts and by which the energized part distributes and exists.
The process of preparing the conductive base material with which a plurality of holes distribute and exist, and the process which makes the coating fluid containing an insulating material immerse the aforementioned conductive base material, and makes the aforementioned insulating material adhere to the outer surface of the aforementioned conductive base material, and the wall surface of the aforementioned hole, A manufacturing method with which it is a manufacturing method of an electrode including the process of exfoliating at least one copy of the aforementioned insulating material adhering to the outer surface of the aforementioned conductive base material, and the aforementioned conductive base material contains a porous metal.
It is an electrode provided with the conductive base material by which a part of surface is covered by the insulating material, The electrode in which a plurality of holes distribute and exist in the aforementioned conductive base material, the wall surface of the aforementioned hole is covered with the aforementioned insulating material, at least one copy of the outer surface of the aforementioned conductive base material is exposed to including a porous metal, and the energized part distributes and exists.
Dependencies are inferred from the claim text.