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US 2023/0348635 A1Published application
Polymeric resin for dielectric applications
AssigneeRohm and Haas Electronic Materials LLC
InventorsColin HAYES, Michael K. GALLAGHER, Gregory PROKOPOWICZ
Life of this patent
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Abstract
There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.
Claims10
A resin composition from a mixture comprising:
- (a) 60-90 weight % of at least one thermosetting resin;
- and
- (b) 10-40 weight % of at least one aryl ether resin.
Dependencies are inferred from the claim text.