Method, device and computer program for producing a weakening line in a surface of a component
AssigneeJENOPTIK Automatisierungstechnik GmbH
InventorsAndreas BODE-MOSIG, Frank SEIDEL
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Abstract
A method for producing a weakening line in a surface of a component. The method comprises a guiding step and a skipping step. In the guiding step, a removal apparatus for removing a material of the surface is guided over a plurality of segments of a predefined line-shaped contour by means of an activated laser beam in order to produce a desired wall thickness for at least one of the segments so as to produce the weakening line. In the skipping step, the segment is skipped if the segment has the desired wall thickness.
Claims12
1-12. (canceled)
A method for producing a weakening line in a surface of a component, the method comprising:
- guiding a removal apparatus for removing a material of the surface over a plurality of portions of a predefined line-shaped contour using an activated laser beam in order to produce a target wall thickness for at least one of the portions in order to produce the weakening line;
- skipping the portion if the portion has the target wall thickness;
- and
- generating, in which a lead-in section is generated fora downstream portion of the contour that follows the portion,
- wherein in the step of skipping, the removal apparatus jumps to the lead-in section in order to move over the lead-in section, and/or in which a lead-out section is generated for an upstream portion of the contour that is arranged upstream of the portion, and
- wherein the removal apparatus is moved over the lead-out section before the step of skipping.
Dependencies are inferred from the claim text.