Loading patent…
AssigneeSekisui Chemical Co., Ltd.
InventorsAkira SHIMOJITOSHO, Yudai OGATA
Estimating the term…
The present invention aims to provide a compound capable of increasing the adhesion strength of adhesive compositions, particularly, even to low polarity adherends. The present invention also aims to provide a method for producing the compound, an adhesive composition containing the compound, and an adhesive tape including an adhesive layer containing the adhesive composition. Provided is a compound including at least one structural unit (A) selected from the group consisting of a structural unit (A-1) and a structural unit (A-1′) that are represented by the following formulas: wherein each R1 represents a hydrogen atom, an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a polar functional group, an aliphatic hydrocarbon group containing a polar functional group, or an aromatic hydrocarbon group containing a polar functional group; n represents an integer of 2 or greater and 4 or less; and n′ represents an integer of 2 or greater and 5 or less.
A compound comprising at least one structural unit (A) selected from the group consisting of a structural unit (A-1) and a structural unit (A-1′) that are represented by the following formulas:
A method for producing a compound including at least one structural unit (A) selected from the group consisting of a structural unit (A-1) and a structural unit (A-1′) that are represented by the following formulas and a structural unit (B) derived from at least one monomer (b) selected from the group consisting of a terpene monomer, a vinyl monomer, and a conjugated diene monomer,
Dependencies are inferred from the claim text.