Optoelectronic semiconductor component, production method, and base

An optoelectronic semiconductor component comprising:

• at least one optoelectronic semiconductor chip for generating a radiation, and
• a housing in which the at least one optoelectronic semiconductor chip is hermetically encapsulated, wherein
• the housing comprises a housing cover which is secured on a main housing body using a connecting means,
• the housing comprises a gas exchange channel,
• the gas exchange channel is hermetically sealed with a seal,
• the main housing body comprises a baseplate which is opaque for the radiation, as a carrier for the at least one optoelectronic semiconductor chip, and the baseplate bears metallic electrical connection regions on both sides, and the housing cover is configured as a radiation exit window for the radiation,
• the gas exchange channel is electrically and optically function-free, and
• the gas exchange channel is located in the baseplate and comprises a metallization which extends onto a bottom housing side of the baseplate and at least on the bottom housing side is thinner than the electrical connection regions, so that the electrical connection regions on the bottom housing side protrude beyond the gas exchange channel and the seal in a direction away from the main housing body.